![]() ![]() ![]() The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial, radio-frequency identification (RFID), light emitting diode (LED) and solar energy. Datacon 8800 FC QUANTUM hs Datacon 8800 TC advanced. Esec 2100 DS Esec 2009 SSI E Esec 2009 fS E Flip Chip. Esec 2100 sD advanced i Esec 2100 hS i Esec 2100 hS Esec 2100 SC Strip Mapping E142 on Esec Die Bonder Soft Solder Die Bonding. It operates through three segments: Die Attach, Packaging and Plating. Datacon 2200 evo Datacon 2200 evo plus Datacon 2200 evo hS Datacon 2200 evo advanced Die Bonding. ![]() The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. (Besi), incorporated in May 1995, is a holding company.
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